Sporting equipment manufactured from conductively doped resin-based materials

ABSTRACT

A sporting equipment device ( 10 ) includes an operator handle ( 15 ) and a striking surface ( 12 ) operatively coupled to the operator handle wherein the striking surface includes a conductively doped, resin-based material including micron conductive fiber in a base resin host. In addition, in one example, the operator handle ( 15 ) includes a conductively doped, resin-based material. In addition, in another example, a sporting equipment device ( 140 ) includes a structure ( 142 ) adapted to covering at least a part of a human body wherein the structure ( 142 ) includes conductively doped resin-based material. In addition, in another example, a sporting equipment device ( 180 ) includes a sheet ( 182 ) of conductively doped resin-based material having a top surface ( 185 ) and a bottom surface ( 187 ) wherein the top surface ( 185 ) is adapted to support an operator and wherein the bottom surface ( 187 ) is adapted for sliding.

RELATED PATENT APPLICATIONS

This Patent Application claims priority to the U.S. Provisional PatentApplication 60/704,036, filed on Jul. 29, 2005, which is hereinincorporated by reference in its entirety.

This Patent Application is a Continuation-in-Part of INT01-002CIPC,filed as U.S. patent application Ser. No. 10/877,092, filed on Jun. 25,2004, which is a Continuation of INT01-002CIP, filed as U.S. patentapplication Ser. No. 10/309,429, filed on Dec. 4, 2002, now issued asU.S. Pat. No. 6,870,516, also incorporated by reference in its entirety,which is a Continuation-in-Part application of docket number INT01-002,filed as U.S. patent application Ser. No. 10/075,778, filed on Feb. 14,2002, now issued as U.S. Pat. No. 6,741,221, which claimed priority toU.S. Provisional Patent Applications Ser. No. 60/317,808, filed on Sep.7, 2001, Ser. No. 60/269,414, filed on Feb. 16, 2001, and Ser. No.60/268,822, filed on Feb. 15, 2001, all of which are incorporated byreference in their entirety.

FIELD OF THE INVENTION

This invention relates to articles for use in sporting and recreationalactivities and, more particularly, to sporting equipment articles moldedof conductively doped resin-based materials comprising micron conductivepowders, micron conductive fibers, or a combination thereof,substantially homogenized within a base resin when molded. Thismanufacturing process yields a conductive part or material usable withinthe EMF, thermal, acoustic, or electronic spectrum(s).

BACKGROUND OF THE INVENTION

By way of example, modern golf clubs are carefully designed to providemaximum performance. For example, when a golf club head comes in contactwith a golf ball, the face of the club is designed to flex inward andspring back in what is known as a “trampoline effect”. The trampolineeffect helps to propel the ball great distances. The club face may bemanufactured from an expensive and exotic material, such as titanium,that exhibits the desired reflex action. Likewise, golf club shafts aredesigned to flex such that the golfer's swing speed is increased viawhipping action. Shaft materials and dimensions are carefully chosen toachieve a whipping action that is predictable and controlled. Similarly,other sports striking equipment, such as baseball bats, hockey sticks,and tennis racquets, use selected materials to reduce weight and toimprove impact response. However, it is difficult to tune optimumfrequency response with materials typically used.

Protection equipment, such as helmets, face masks, shields, and fencinglame, and is also carefully designed to provide player protection whileminimizing weight. For example, typical protection equipment ismanufactured from rigid plastics. While these plastic materials mayprovide protection, the materials typically do not provide a tunableresponse to impacts. As a result, the ability of the materials toprotect against concussive injury may not be optimized. In addition,since most plastics exhibit high intrinsic resistivity, protectionequipment is typically non-conductive. It is difficult, therefore, theintegrated devices, such as antennas and sensors, in typical protectiondevices.

Sporting boards, such as snow boards, surf boards, skate boards, andskis, are also designed to meet stringent performance requirements. Forexample, typical boards are manufactured from fiberglass composites.While fiberglass composites may provide high strength, these materialstypically do not provide a tunable flexing response. As a result, theability of the materials to provide optimum performance is limited.

BRIEF DESCRIPTION OF THE DRAWINGS

The present invention and the corresponding advantages and featuresprovided thereby will be best understood and appreciated upon review ofthe following detailed description of the invention, taken inconjunction with the following drawings, where like numerals representlike elements, in which:

FIG. 1 illustrates one example of a sporting equipment device depictingone embodiment of the invention.

FIG. 2 illustrates a conductively doped resin-based material wherein theconductive materials comprise a micron conductive powder(s).

FIG. 3 illustrates a conductively doped resin-based material wherein theconductive materials comprise micron conductive fiber(s).

FIG. 4 illustrates a conductively doped resin-based material wherein theconductive materials comprise both micron conductive powder(s) andmicron conductive fiber(s).

FIGS. 5 a and 5 b illustrate conductive fabric-like materials formedfrom the conductively doped resin-based material using woven and webbedconstruction, respectively.

FIGS. 6 a and 6 b illustrate, in simplified schematic form, an injectionmolding apparatus and an extrusion molding apparatus that may be used tomold circuit conductors of a conductively doped resin-based material.

FIG. 7 illustrates one example of a sporting equipment device depictingone embodiment of the invention.

FIG. 8 illustrates one example of a sporting equipment device depictingone embodiment of the invention.

FIG. 9 illustrates one example of a sporting equipment device depictingone embodiment of the invention.

FIG. 10 illustrates one example of a sporting equipment device depictingone embodiment of the invention.

FIG. 11 illustrates one example of a sporting equipment device depictingone embodiment of the invention.

FIG. 12 illustrates one example of a sporting equipment device depictingone embodiment of the invention.

FIG. 13 illustrates one example of a sporting equipment device depictingone embodiment of the invention.

FIG. 14 illustrates one example of a sporting equipment device depictingone embodiment of the invention.

FIG. 15 illustrates one example of a sporting equipment device depictingone embodiment of the invention.

FIG. 16 illustrates one example of a sporting equipment device depictingone embodiment of the invention.

FIG. 17 illustrates one example of a sporting equipment device depictingone embodiment of the invention.

FIG. 18 illustrates one example of a sporting equipment device depictingone embodiment of the invention.

FIG. 19 illustrates one example of a sporting equipment device depictingone embodiment of the invention.

FIG. 20 illustrates one example of a sporting equipment device depictingone embodiment of the invention.

FIG. 21 illustrates one example of a sporting equipment device depictingone embodiment of the invention.

FIGS. 22-24 illustrate one example of a part of a sporting equipmentdevice and method of manufacture depicting one embodiment of theinvention.

FIG. 25 illustrates one example of a sporting equipment device depictingone embodiment of the invention.

FIG. 26 illustrates one example of a sporting equipment device depictingone embodiment of the invention.

DETAILED DESCRIPTION OF THE INVENTION

Briefly, a sporting equipment device includes an operator handle and astriking surface operatively coupled to the operator handle wherein thestriking surface includes a conductively doped, resin-based materialincluding micron conductive fiber in a base resin host. In addition, inone example, the operator handle includes a conductively doped,resin-based material. In addition, in another example, a sportingequipment device includes a structure adapted to covering at least apart of a human body wherein the structure includes conductively dopedresin-based material. In addition, in another example, a sportingequipment device includes a sheet of conductively doped resin-basedmaterial having a top surface and a bottom surface wherein the topsurface is adapted to support an operator and wherein the bottom surfaceis adapted for sliding. In addition, in another example, a sportingequipment device includes an operator handle wherein the operator handlecomprises continuous strands of micron conductive fiber molded into aresin-based material and a striking surface operatively coupled to theoperator handle.

As such, a sporting equipment device is disclosed with excellentperformance including tunable frequency response, low cost ofmanufacture, durability, and low weight. In addition, antenna devices orconductive sensing may be integrated into the device due to theconductivity of the conductively doped resin-based material. Otheradvantages will be recognized by one of ordinary skill in the art.

The conductively doped resin-based materials can be molded, extruded orthe like to provide almost any desired shape or size. The moldedconductively doped resin-based materials can also be cut, stamped, orvacuumed formed from an injection molded or extruded sheet or bar stock,over-molded, laminated, milled or the like to provide the desired shapeand size. The thermal, electrical, and acoustical continuity and /orconductivity characteristics of articles or parts fabricated usingconductively doped resin-based materials depend on the composition ofthe conductively doped resin-based materials. The type of base resin,the type of doping material, and the relative percentage of dopingmaterial incorporated into the base resin can be adjusted to achieve thedesired structural, electrical, or other physical characteristics of themolded material. The selected materials used to fabricate the articlesor devices are substantially homogenized together using moldingtechniques and or methods such as injection molding, over-molding,insert molding, compression molding, thermo-set, protrusion, extrusion,calendaring, or the like. Characteristics related to 2D, 3D, 4D, and 5Ddesigns, molding and electrical characteristics, include the physicaland electrical advantages that can be achieved during the moldingprocess of the actual parts and the molecular polymer physics associatedwithin the conductive networks within the molded part(s) or formedmaterial(s).

In the conductively doped resin-based material, electrons travel frompoint to point, following the path of least resistance. Most resin-basedmaterials are insulators and represent a high resistance to electronpassage. The doping of the conductive loading into the resin-basedmaterial alters the inherent resistance of the polymers. At a thresholdconcentration of conductive loading, the resistance through the combinedmass is lowered enough to allow electron movement. Speed of electronmovement depends on conductive doping concentration and material makeup,that is, the separation between the conductive doping particles.Increasing conductive loading content reduces interparticle separationdistance, and, at a critical distance known as the percolation point,resistance decreases dramatically and electrons move rapidly.

Resistivity is a material property that depends on the atomic bondingand on the microstructure of the material. The atomic microstructurematerial properties within the conductively doped resin-based materialare altered when molded into a structure. A substantially homogenizedconductive microstructure of delocalized valance electrons is createdwithin the valance and conduction bands of the molecules. Thismicrostructure provides sufficient charge carriers within the moldedmatrix structure. As a result, a low density, low resistivity,lightweight, durable, resin based polymer microstructure material isachieved. This material exhibits conductivity comparable to that ofhighly conductive metals such as silver, copper or aluminum, whilemaintaining the superior structural characteristics found in manyplastics and rubbers or other structural resin based materials.

Conductively doped resin-based materials lower the cost of materials andof the design and manufacturing processes needed for fabrication ofmolded articles while maintaining close manufacturing tolerances. Themolded articles can be manufactured into infinite shapes and sizes usingconventional forming methods such as injection molding, over-molding,compression molding, thermoset molding, or extrusion, calendaring, orthe like. The conductively doped resin-based materials, when molded,typically but not exclusively produce a desirable usable range ofresistivity of less than about 5 to more than about 25 ohms per square,but other resistivity values can be achieved by varying the dopant(s),the doping parameters and/or the base resin selection(s).

The conductively doped resin-based materials comprise micron conductivepowders, micron conductive fibers, or any combination thereof, which aresubstantially homogenized together within the base resin, during themolding process, yielding an easy to produce low cost, electrical,thermal, and acoustical performing, close tolerance manufactured part orcircuit. The resulting molded article comprises a three dimensional,continuous capillary network of conductive doping particles containedand or bonding within the polymer matrix. Exemplary micron conductivepowders include carbons, graphites, amines, eeonomers, or the like,and/or of metal powders such as nickel, copper, silver, aluminum,nichrome, or plated or the like. The use of carbons or other forms ofpowders such as graphite(s) etc. can create additional low levelelectron exchange and, when used in combination with micron conductivefibers, creates a micron filler element within the micron conductivenetwork of fiber(s) producing further electrical conductivity as well asacting as a lubricant for the molding equipment. Carbon nano-tubes maybe added to the conductively doped resin-based material. The addition ofconductive powder to the micron conductive fiber doping may improve theelectrical continuity on the surface of the molded part to offset anyskinning effect that occurs during molding.

The micron conductive fibers may be metal fiber or metal plated fiber.Further, the metal plated fiber may be formed by plating metal onto ametal fiber or by plating metal onto a non-metal fiber. Exemplary metalfibers include, but are not limited to, stainless steel fiber, copperfiber, nickel fiber, silver fiber, aluminum fiber, nichrome fiber, orthe like, or combinations thereof. Exemplary metal plating materialsinclude, but are not limited to, copper, nickel, cobalt, silver, gold,palladium, platinum, ruthenium, rhodium, and nichrome, and alloys ofthereof. Any platable fiber may be used as the core for a non-metalfiber. Exemplary non-metal fibers include, but are not limited to,carbon, graphite, polyester, basalt, melamine, man-made andnaturally-occurring materials, and the like. In addition, superconductormetals, such as titanium, nickel, niobium, and zirconium, and alloys oftitanium, nickel, niobium, and zirconium may also be used as micronconductive fibers and/or as metal plating onto fibers in the presentinvention.

Where micron fiber is combined with base resin, the micron fiber may bepretreated to improve performance. According to one embodiment of thepresent invention, conductive or non-conductive powders are leached intothe fibers prior to extrusion. In other embodiments, the fibers aresubjected to any or several chemical modifications in order to improvethe fibers interfacial properties. Fiber modification processes include,but are not limited to: chemically inert coupling agents; gas plasmatreatment; anodizing; mercerization; peroxide treatment; benzoylation;or other chemical or polymer treatments.

Chemically inert coupling agents are materials that are molecularlybonded onto the surface of metal and or other fibers to provide surfacecoupling, mechanical interlocking, inter-diffusion and adsorption andsurface reaction for later bonding and wetting within the resin-basedmaterial. This chemically inert coupling agent does not react with theresin-based material. An exemplary chemically inert coupling agent issilane. In a silane treatment, silicon-based molecules from the silanebond to the surface of metal fibers to form a silicon layer. The siliconlayer bonds well with the subsequently extruded resin-based material yetdoes not react with the resin-based material. As an additional featureduring a silane treatment, oxane bonds with any water molecules on thefiber surface to thereby eliminate water from the fiber strands. Silane,amino, and silane-amino are three exemplary pre-extrusion treatments forforming chemically inert coupling agents on the fiber.

In a gas plasma treatment, the surfaces of the metal fibers are etchedat atomic depths to re-engineer the surface. Cold temperature gas plasmasources, such as oxygen and ammonia, are useful for performing a surfaceetch prior to extrusion. In one embodiment of the present invention, gasplasma treatment is first performed to etch the surfaces of the fiberstrands. A silane bath coating is then performed to form a chemicallyinert silicon-based film onto the fiber strands. In another embodiment,metal fiber is anodized to form a metal oxide over the fiber. The fibermodification processes described herein are useful for improvinginterfacial adhesion, improving wetting during homogenization, and/orreducing oxide growth (when compared to non-treated fiber). Pretreatmentfiber modification also reduces levels of particle dust, fines, andfiber release during subsequent capsule sectioning, cutting or vacuumline feeding.

The resin-based structural material may be any polymer resin orcombination of compatible polymer resins. Non-conductive resins orinherently conductive resins may be used as the structural material.Conjugated polymer resins, one example being polythiophene, may be usedas the structural material. Complex polymer resins, examples beingpolyimide and polyamide, may be used as the structural material.Inherently conductive resins may be used as the structural material. Thedielectric properties of the resin-based material will have a directeffect upon the final electrical performance of the conductively dopedresin-based material. Many different dielectric properties are possibledepending on the chemical makeup and/or arrangement, such as linking,cross-linking or the like, of the polymer, co-polymer, monomer,ter-polymer, ionomer, or homo-polymer material. Structural material canbe, here given as examples and not as an exhaustive list, polymer resinsproduced by GE PLASTICS, Pittsfield, Mass., a range of other plasticsproduced by GE PLASTICS, Pittsfield, Mass., a range of other plasticsproduced by other manufacturers, silicones produced by GE SILICONES,Waterford, N.Y., or other flexible resin-based rubber compounds producedby other manufacturers.

The resin-based structural material doped with micron conductivepowders, micron conductive fibers, or in combination thereof can bemolded, using conventional molding methods such as injection molding orover-molding, or extrusion to create desired shapes and sizes. Themolded conductively doped resin-based materials can also be stamped, cutor milled as desired to form create the desired shapes and formfactor(s). The doping composition and directionality associated with themicron conductors within the doped base resins can affect the electricaland structural characteristics of the articles and can be preciselycontrolled by mold designs, gating and or protrusion design(s) and orduring the molding process itself. In addition, the resin base can beselected to obtain the desired thermal characteristics such as very highmelting point or specific thermal conductivity.

A resin-based sandwich laminate could also be fabricated with random orcontinuous webbed micron stainless steel fibers or other conductivefibers, forming a cloth like material. The webbed conductive fiber canbe laminated or the like to materials such as Teflon, Polyesters, or anyresin-based flexible or solid material(s), which when discretelydesigned in fiber content(s), orientation(s) and shape(s), will producea very highly conductive flexible cloth-like material. Such a cloth-likematerial could also be used in forming articles that could be embeddedin a person's clothing as well as other resin materials such asrubber(s) or plastic(s). When using conductive fibers as a webbedconductor as part of a laminate or cloth-like material, the fibers mayhave diameters of between about 3 and 12 microns, typically betweenabout 8 and 12 microns or in the range of about 10 microns, withlength(s) that can be seamless or overlapping.

The conductively doped resin-based material may also be formed into aprepreg laminate, cloth, or webbing. A laminate, cloth, or webbing ofthe conductively doped resin-based material is first homogenized with aresin-based material. In various embodiments, the conductively dopedresin-based material is dipped, coated, sprayed, and/or extruded withresin-based material to cause the laminate, cloth, or webbing to adheretogether in a prepreg grouping that is easy to handle. This prepreg isplaced, or laid up, onto a form and is then heated to form a permanentbond. In another embodiment, the prepreg is laid up onto theimpregnating resin while the resin is still wet and is then cured byheating or other means. In another embodiment, the wet lay-Lip isperformed by laminating the conductively doped resin-based prepreg overa honeycomb structure. In another embodiment, the honeycomb structure ismade from conductively doped, resin-based material. In yet anotherembodiment, a wet prepreg is formed by spraying, dipping, or coating theconductively doped resin-based material laminate, cloth, or webbing inhigh temperature capable paint.

Prior art carbon fiber and resin-based composites are found to displayunpredictable points of failure. In carbon fiber systems there is littleif any elongation of the structure. By comparison, in the presentinvention, the conductively doped resin-based material, even if formedwith carbon fiber or metal plated carbon fiber, displays greaterstrength of the mechanical structure due to the substantialhomogenization of the fiber created by the moldable capsules. As aresult a structure formed of the conductively doped resin-based materialof the present invention will maintain structurally even if crushedwhile a comparable carbon fiber composite will break into pieces.

The conductively doped resin-based material of the present invention canbe made resistant to corrosion and/or metal electrolysis by selectingmicron conductive fiber and/or micron conductive powder dopants and baseresins that are resistant to corrosion and/or metal electrolysis. Forexample, if a corrosion/electrolysis resistant base resin is combinedwith fibers/powders or in combination of such as stainless steel fiber,inert chemical treated coupling agent warding against corrosive fiberssuch as copper, silver and gold and or carbon fibers/powders, thencorrosion and/or metal electrolysis resistant conductively dopedresin-based material is achieved. Another additional and importantfeature of the present invention is that the conductively dopedresin-based material of the present invention may be made flameretardant. Selection of a flame-retardant (FR) base resin materialallows the resulting product to exhibit flame retardant capability. Thisis especially important in applications as described herein.

The substantially homogeneous mixing of micron conductive fiber and/ormicron conductive powder and base resin described in the presentinvention may also be described as doping. That is, the substantiallyhomogeneous mixing transforms a typically non-conductive base resinmaterial into a conductive material. This process is analogous to thedoping process whereby a semiconductor material, such as silicon, can beconverted into a conductive material through the introduction ofdonor/acceptor ions as is well known in the art of semiconductordevices. Therefore, the present invention uses the term doping to meanconverting a typically non-conductive base resin material into aconductive material through the substantially homogeneous mixing ofmicron conductive fiber and/or micron conductive powder within a baseresin.

As an additional and important feature of the present invention, themolded conductor doped resin-based material exhibits excellent thermaldissipation characteristics. Therefore, articles manufactured from themolded conductor doped resin-based material can provide added thermaldissipation capabilities to the application. For example, heat can bedissipated from electrical devices physically and/or electricallyconnected to an article of the present invention.

As a significant advantage of the present invention, articlesconstructed of the conductively doped resin-based material can be easilyinterfaced to an electrical circuit or grounded. In one embodiment, awire can be attached to conductively doped resin-based articles via ascrew that is fastened to the article. For example, a simple sheet-metaltype, self tapping screw can, when fastened to the material, can achieveexcellent electrical connectivity via the conductive matrix of theconductively doped resin-based material. To facilitate this approach aboss may be molded as part of the conductively doped resin-basedmaterial to accommodate such a screw. Alternatively, if a solderablescrew material, such as copper, is used, then a wire can be soldered tothe screw is embedded into the conductively doped resin-based material.In another embodiment, the conductively doped resin-based material ispartly or completely plated with a metal layer. The metal layer formsexcellent electrical conductivity with the conductive matrix. Aconnection of this metal layer to another circuit or to ground is thenmade. For example, if the metal layer is solderable, then a solderedconnection may be made between the article and a grounding wire.

Where a metal layer is formed over the surface of the conductively dopedresin-based material, any of several techniques may be used to form thismetal layer. This metal layer may be used for visual enhancement of themolded conductively doped resin-based material article or to otherwisealter performance properties. Well-known techniques, such as electrolessmetal plating, electro plating, electrolytic metal plating, sputtering,metal vapor deposition, metallic painting, or the like, may be appliedto the formation of this metal layer. If metal plating is used, then theresin-based structural material of the conductively doped, resin-basedmaterial is one that can be metal plated. There are many of the polymerresins that can be plated with metal layers. For example, GE Plastics,SUPEC, VALOX, ULTEM, CYCOLAC, UGIKRAL, STYRON, CYCOLOY are a fewresin-based materials that can be metal plated. Electroless plating istypically a multiple-stage chemical process where, for example, a thincopper layer is first deposited to form a conductive layer. Thisconductive layer is then used as an electrode for the subsequent platingof a thicker metal layer.

A typical metal deposition process for forming a metal layer onto theconductively doped resin-based material is vacuum metallization. Vacuummetallization is the process where a metal layer, such as aluminum, isdeposited on the conductively doped resin-based material inside a vacuumchamber. In a metallic painting process, metal particles, such assilver, copper, or nickel, or the like, are dispersed in an acrylic,vinyl, epoxy, or urethane binder. Most resin-based materials accept andhold paint well, and automatic spraying systems apply coating withconsistency. In addition, the excellent conductivity of the conductivelydoped resin-based material of the present invention facilitates the useof extremely efficient, electrostatic painting techniques.

The conductively doped resin-based materials can be contacted in any ofseveral ways. In one embodiment, a pin is embedded into the conductivelydoped resin-based material by insert molding, ultrasonic welding,pressing, or other means. A connection with a metal wire can easily bemade to this pin and results in excellent contact to the conductivelydoped resin-based material conductive matrix. In another embodiment, ahole is formed in to the conductively doped resin-based material eitherduring the molding process or by a subsequent process step such asdrilling, punching, or the like. A pin is then placed into the hole andis then ultrasonically welded to form a permanent mechanical andelectrical contact. In yet another embodiment, a pin or a wire issoldered to the conductively doped resin-based material. In this case, ahole is formed in the conductively doped resin-based material eitherduring the molding operation or by drilling, stamping, punching, or thelike. A solderable layer is then formed in the hole. The solderablelayer is preferably formed by metal plating. A conductor is placed intothe hole and then mechanically and electrically bonded by point, wave,or reflow soldered.

Another method to provide connectivity to the conductively dopedresin-based material is through the application of a solderable ink filmto the surface. One exemplary solderable ink is a combination of copperand solder particles in an epoxy resin binder. The resulting mixture isan active, screen-printable and dispensable material. During curing, thesolder reflows to coat and to connect the copper particles and tothereby form a cured surface that is directly solderable without theneed for additional plating or other processing steps. Any solderablematerial may then be mechanically and/or electrically attached, viasoldering, to the conductively doped resin-based material at thelocation of the applied solderable ink. Many other types of solderableinks can be used to provide this solderable surface onto theconductively doped resin-based material of the present invention.Another exemplary embodiment of a solderable ink is a mixture of one ormore metal powder systems with a reactive organic medium. This type ofink material is converted to solderable pure metal during a lowtemperature cure without any organic binders or alloying elements.

A ferromagnetic conductively doped resin-based material may be formed ofthe present invention to create a magnetic or magnetizable form of thematerial. Ferromagnetic micron conductive fibers and/or ferromagneticconductive powders are substantially homogenized with the base resin.Ferrite materials and/or rare earth magnetic materials are added as aconductive doping to the base resin. With the substantially homogeneousmixing of the ferromagnetic micron conductive fibers and/or micronconductive powders, the ferromagnetic conductively doped resin-basedmaterial is able to produce an excellent low cost, low weight, highaspect ratio magnetize-able item. The magnets and magnetic devices ofthe present invention can be magnetized during or after the moldingprocess. Adjusting the doping levels and or dopants of ferromagneticmicron conductive fibers and/or ferromagnetic micron conductive powdersthat are homogenized within the base resin can control the magneticstrength of the magnets and magnetic devices. By increasing the aspectratio of the ferromagnetic doping, the strength of the magnet ormagnetic devices can be substantially increased. The substantiallyhomogenous mixing of the conductive fibers/powders or in combinationsthere of allows for a substantial amount of dopants to be added to thebase resin without causing the structural integrity of the item todecline mechanically. The ferromagnetic conductively doped resin-basedmagnets display outstanding physical properties of the base resin,including flexibility, moldability, strength, and resistance toenvironmental corrosion, along with superior magnetic ability. Inaddition, the unique ferromagnetic conductively doped resin-basedmaterial facilitates formation of items that exhibit superior thermaland electrical conductivity as well as magnetism.

A high aspect ratio magnet is easily achieved through the use offerromagnetic conductive micron fiber or through the combination offerromagnetic micron powder with conductive micron fiber. The use ofmicron conductive fiber allows for molding articles with a high aspectratio of conductive fibers/powders or combinations there of in a crosssectional area. If a ferromagnetic micron fiber is used, then this highaspect ratio translates into a high quality magnetic article.Alternatively, if a ferromagnetic micron powder is combined with micronconductive fiber, then the magnetic effect of the powder is effectivelyspread throughout the molded article via the network of conductive fibersuch that an effective high aspect ratio molded magnetic article isachieved. The ferromagnetic conductively doped resin-based material maybe magnetized, after molding, by exposing the molded article to a strongmagnetic field. Alternatively, a strong magnetic field may be used tomagnetize the ferromagnetic conductively doped resin-based materialduring the molding process.

The ferromagnetic conductively doped is in the form of fiber, powder, ora combination of fiber and powder. The micron conductive powder may bemetal fiber or metal plated fiber or powders. If metal plated fiber isused, then the core fiber is a platable material and may be metal ornon-metal. Exemplary ferromagnetic conductive fiber materials includeferrite, or ceramic, materials as nickel zinc, manganese zinc, andcombinations of iron, boron, and strontium, and the like. In addition,rare earth elements, such as neodymium and samarium, typified byneodymium-iron-boron, samarium-cobalt, and the like, are usefulferromagnetic conductive fiber materials. Exemplary ferromagnetic micronpowder leached onto the conductive fibers include ferrite, or ceramic,materials as nickel zinc, manganese zinc, and combinations of iron,boron, and strontium, and the like. In addition, rare earth elements,such as neodymium and samarium, typified by neodymium-iron-boron,samarium-cobalt, and the like, are useful ferromagnetic conductivepowder materials. A ferromagnetic conductive doping may be combined witha non-ferromagnetic conductive doping to form a conductively dopedresin-based material that combines excellent conductive qualities withmagnetic capabilities.

FIG. 1 illustrates one example of a sporting equipment device depictingone embodiment of the invention. A golf club driver 5 is shown. The golfclub driver 5 includes an operator handle 15 and a striking surface 10attached to the operator handle 15. The striking surface 10, or clubhead, may include several parts including a face 12, a hosel 14, a sole18, and a back 16. In one example, the back 16 and sole 18 support theface 12 while the hosel 14 connects to the operator handle 15, or shaft.In various embodiments, any, any combination, or all of the face 12,hosel 14, sole 18, and the back 16 of the golf club driver head 10 maybe formed of the conductively doped resin-based material. For example,the entire golf club head 10 may be formed of the conductively dopedresin-based material by, for example, injection molding.

Typical golf club driver head construction utilizes a face formed oftitanium or other specialty metal attached to a two-piece bodycomprising the sole and back. The hosel is typically formed along withthe sole and back sections and allows the head to attach to a shaft.When the face of the club comes in contact with the golf ball it flexesinward and springs back in what is known as “the trampoline effect”.This effect helps to propel the ball greater distances than traditionalwooden clubs. The grooves on the face of the club help to give the ballthe desired backspin for aerodynamic stability in flight. In the pastfew years there has been a trend of increasing the size of the clubheads. The larger sized heads give the average golfer a bigger strikingface that tends to be more forgiving with misaligned or improperlystruck golf balls.

In one embodiment of the present invention, the face 12 is molded of theconductively doped resin-based material and inserted into interiorgrooves, not shown, formed in the back 16 and sole 18 that are formed ofmetal. The face 12 is attached to the grooves by gluing, ultrasonicwelding, chemical solvent, or the like. In another embodiment, the face12 may be metal plated and/or metal coated for appearance. Theconductively doped resin-based face 12 is preferably formed with apercent conductive loading, by weight, such that the “trampoline effect”of the face 12 matches the compression and subsequent expansion of theball upon impact. By matching the compression and expansion of the face12 with the compression and expansion of the ball, a greater energypotential is realized and more distance is achieved. In anotherembodiment, the face 12 is not metal plated and/or metal coated.

The use of the conductively doped, resin-based material of the presentinvention allows the creation of a striking face 12 having anexceptionally large “sweet spot”. The resonant frequency response of theconductively doped, resin-based material can be easily tuned byadjusting the percentage doping of conductive material and/or type ofbase resin. For example, while the Rockwell hardness of a sheet gradetype 316 stainless steel is in the range of about 95 HRB, micronconductive fiber grade stainless steel should exhibit a hardness ofabout 70 HRB or less. When combined with the resin-based host, theconductively doped, resin-based material is tuned to provide a resonantfrequency “trampoline” response optimized to deliver maximum energy tothe ball impact, excellent surface durability, and to minimize energyvibration in club shaft.

In another embodiment, the entire golf club driver head 10 is formed ofthe conductively doped resin-based material of the present invention. Inthis embodiment, the back 16 and the sole 18 are molded to allowweighted inserts into the hollow perimeter of the club head 10. Theweighted inserts are insertion molded or over-molded into the interiorof the club head 10. The conductively doped resin-based face 12 isinserted into place and the sections are joined by gluing, ultrasonicwelding, chemical solvent, or the like. The conductively dopedresin-based club head 10 is then metal plated and/or metal coated. Theinserts give the conductively doped resin-based club head 10 enough massto effectively transfer the needed energy to the golf ball. In anotherembodiment, the conductively doped resin-based club head 10 is painted.The conductive characteristic of the conductively doped resin-basedmaterial is particularly useful for electrostatic painting. In yetanother embodiment, the conductively doped resin-based club head 10 isformed with coloring agents or dyes in the resin matrix to allow for thedesired appearance after manufacturing.

In another embodiment, the golf club shaft 15 comprises the conductivelydoped resin-based material of the present invention. Typical golf clubshaft construction utilizes various metals or graphite. A mechanicaladvantage is gained by having a larger amount of flex in the shaft for aweaker player or a player with a slow swing due to the whipping actionof the stick. When a player has a stronger faster swing however, thewhipping action of the club is not as desirable due to the amount ofprecision and control that is lost.

In one embodiment of the present invention, the shaft 15 may be moldedentirely of the conductively doped resin-based material of the presentinvention. In another embodiment, the shaft 15 may be molded with ahollow center core to allow a rod of metal or some other material to beinserted for added weight and/or added rigidity. The shaft 15 may beformed to the desired shape with a percent conductive loading, byweight, such that the amount of flex in the handle corresponds to theintended players' strength and speed of swing. In one embodiment, thegolf club shaft 15 may be formed of the conductively doped resin-basedmaterial of the present invention and then metal plated and/or metalcoated. In another embodiment, the golf club shaft 15 may be formed ofthe conductively doped resin-based material of the present inventionwith a coloring or dye added to the resin matrix to achieve the desiredappearance after the manufacturing process.

FIG. 7 illustrates one example of a sporting equipment device depictingone embodiment of the invention. A golf club iron head 100 is shown. Ingolf, “irons” are used for short to middle distance shots and are calledirons because of the traditional material used in their manufacture. Theiron head 20 comprises the conductively doped resin-based material ofthe present invention. In the embodiment, any component or severalcomponents, of the iron head 100 comprises the conductively dopedresin-based material of the present invention. In various embodiments,the face, not shown, hosel 102, sole 104, and/or the back 103 of thegolf club iron head 100 may be formed of the conductively dopedresin-based material.

Typical golf club iron head construction utilizes a forged or moldedmetal design that allows most of the weight of the club to be dispersedaround the edge. The weight along the perimeter helps to keep the clubfrom twisting or turning when striking the ball slightly off center. Thegrooves on the face of the club help to give the ball the desiredbackspin for aerodynamic stability in flight.

In one embodiment of the present invention, the golf club iron head 100may be formed by over-molding the conductively doped resin-basedmaterial onto a metal weight, not shown, that is encased within theperimeter of the club head 100. The golf club iron head 20 may then bemetal plated and/or metal coated. In another embodiment, the golf clubiron head 100 may be formed in two sections where the back 103 and sole104 are one piece and the face is the other. A metal weight may then beinserted before joining the sections together by gluing, ultrasonicwelding, chemical solvent, or the like. The golf club iron head I 00 maythen be metal plated and/or metal coated.

The use of the conductively doped, resin-based material of the presentinvention allows the creation of an iron 100 having an exceptionallylarge “sweet spot”. The resonant frequency response of the conductivelydoped, resin-based material can be easily tuned by adjusting thepercentage doping of conductive material and/or type of base resin. Whencombined with the resin-based host, the conductively doped, resin-basedmaterial is tuned to provide a resonant frequency “trampoline” responseoptimized to deliver maximum energy to the ball impact, excellentsurface durability, and to minimize energy vibration in the club shaft.

In another embodiment of the present invention, a putter head is formedof the conductively doped resin-based material of the present invention.In one embodiment, the putter head is molded and then metal platedand/or metal coated for appearance. In another embodiment, the putterhead is molded with a coloring or dye in the resin matrix to allow forthe desired appearance after the manufacturing process.

FIG. 8 illustrates one example of a sporting equipment device depictingone embodiment of the invention. A baseball bat 105 is shown. Thebaseball bat 105 includes an operator handle 106 attached a strikingsurface 108, or barrel. Typically a baseball bat is formed of hardwoodsuch as hickory or a metal such as aluminum. The typical aluminumbaseball bat utilizes the “trampoline effect” much like the golf clubdrivers mentioned earlier. In one embodiment, a hollow bat structure105, including both operator handle 106 and striking surface 108, ismolded of the conductively doped resin-based material of the presentinvention in the desired length and diameter. The conductively dopedresin-based baseball bat 105 is preferably formed to the desiredthickness with a percent conductive loading, by weight, such that the“trampoline effect” of the baseball bat 105 matches the compression andsubsequent expansion of the baseball upon impact. The use of theconductively doped, resin-based material of the present invention allowsthe creation of a bat 105 having an exceptionally large “sweet spot”.The resonant frequency response of the conductively doped, resin-basedmaterial can be easily tuned by adjusting the percentage doping ofconductive material and/or type of base resin. When combined with theresin-based host, the conductively doped, resin-based material is tunedto provide a resonant frequency “trampoline” response optimized todeliver maximum energy to the ball impact, excellent surface durability,and to minimize energy vibration in bat handle.

The interior of a hollow bat 105 may be filled with filler such as metalin order to simulate the approximate weight and feel of a woodenbaseball bat and plugged at the end. In one embodiment, the conductivelydoped resin-based baseball bat 105 may be metal plated and/or metalcoated. In another embodiment, the conductively doped resin-basedbaseball bat 105 may be formed with a coloring or dye in the resinmatrix in order to achieve the desired appearance after manufacturing.

FIG. 9 illustrates one example of a sporting equipment device depictingone embodiment of the invention. A hockey stick 110 is shown. The hockeystick 110 includes an operator handle 18 attached to a striking surface114, or blade. Typical hockey stick construction utilizes a wood, suchas aspen, graphite, or a layered composite of wood and fiberglass. Thesize and construction of the hockey stick determines the amount of flexthat it is capable of. A mechanical advantage is gained by having alarge amount of flex in the handle for a younger weaker player due tothe whipping action of the stick. When a player matures and is able toswing the hockey stick at greater speeds the whipping action is desiredless due to the amount of precision and control that is lost.

In one embodiment of the present invention, the hockey stick 110,including operator handle 118 and striking surface 114, is molded of theconductively doped resin-based material as a one-piece unit. In anotherembodiment, the operator handle 118 and striking surface 114 are moldedseparately of the conductively doped resin-based material to allow thestriking surface 114 to be changed when it starts to show signs of wear.The conductively doped resin-based hockey stick 110 is preferably formedto the desired thickness with a percent conductive loading, by weight,such that the amount of flex in the operator handle 118 corresponds tothe intended players' strength and speed of swing. In anotherembodiment, the operator handle 118 for the conductively dopedresin-based hockey stick is designed with a hollow center channel toallow for different weights and/or materials to be inserted and controlthe feel and flex of the hockey stick 110. The use of the conductivelydoped, resin-based material of the present invention allows the creationof a hockey stick 110 having exceptional performance. The resonantfrequency response of the conductively doped, resin-based material canbe easily tuned by adjusting the percentage doping of conductivematerial and/or type of base resin. When combined with the resin-basedhost, the conductively doped, resin-based material is tuned to provide aresonant frequency “trampoline” response optimized to deliver maximumenergy to the puck impact, excellent surface durability, and to minimizeenergy vibration in operator handle 118.

FIG. 10 illustrates one example of a sport equipment device depictingone embodiment of the invention. A tennis racquet 120 is shown. Thetennis racquet 120 includes an operator handle 128 attached to astriking surface 124 and 126. The striking surface 124 and 126 mayfurther include a head frame 124 attached to the operator handle 128 anda string grid 126 attached to the head frame 124. Traditional tennisracquets were formed of wood and have been gradually replaced withsteel, fiberglass, titanium, aluminum, or graphite. The evolution of thetennis racquet has been driven by the desire to keep the head frame andhandle as light weight and stiff as possible.

In one embodiment of the present invention, the operator handle 128 andhead frame 124 of the tennis racquet 120 are molded of the conductivelydoped resin-based material of the present invention. The molded racquetmay then be metal plated and/or metal coated. In another embodiment, thetennis racquet 120 is molded of the conductively doped resin-basedmaterial with a coloring or dye in the resin matrix to allow the desiredappearance after the manufacturing process. The conductively dopedresin-based tennis racquet 120 is preferably formed to the desired shapewith a percent conductive loading, by weight, such that the flex of theframe and handle is kept to a minimal amount. The choice of the baseresin is selected from any number of resins capable of providing thetensile strength needed for the tennis racquet 120. In one embodiment,the string grid 126 may be formed of the conductively doped resin-basedmaterial by, for example, extrusion of a continuous string that isstrung into the head frame 124.

FIG. 11 illustrates one example of a sports equipment device depictingone embodiment of the invention. A racquetball racquet 130 is shown. Theracquetball racquet 130 includes an operator handle 1 38 attached to astriking surface 134 and 136. The striking surface 134 and 136 mayfurther include a head frame 134 attached to the operator handle 138 anda string grid 136 attached to the head frame 134. Traditionalracquetball racquets were formed of wood and have been graduallyreplaced with steel, fiberglass, titanium, aluminum, or graphite. Theevolution of the racquetball racquet has been driven by the desire tokeep the head frame and handle as light weight and stiff as possible.

In one embodiment of the present invention, the operator handle 138 andhead frame 134 of the racquetball racquet 130 are molded of theconductively doped resin-based material of the present invention. Themolded racquet may then be metal plated and/or metal coated. In anotherembodiment, the racquetball racquet 120 is molded of the conductivelydoped resin-based material with a coloring or dye in the resin matrix toallow the desired appearance after the manufacturing process. Theconductively doped resin-based tennis racquet 130 is preferably formedto the desired shape with a percent conductive loading, by weight, suchthat the flex of the frame and handle is kept to a minimal amount. Thechoice of the base resin is selected from any number of resins capableof providing the tensile strength needed for the tennis racquet 130. Inone embodiment, the string grid 136 may be formed of the conductivelydoped resin-based material by, for example, extrusion of a continuousstring that is strung into the head frame 134.

FIG. 12 illustrates one example of a sporting equipment device depictingone embodiment of the invention. An electronic fencing foil 140 includesan operator handle 147 attached to a striking surface 142 and 144. Theelectric fencing foil 140 may include a striking surface including a tip142 and a blade 144 and an operator handle including a handle 147, abell guard 148, and an electrical connector 146. In various embodiments,any, any combination, or all of these components may be formed of theconductively doped resin-based material of the present invention.

In fencing competitions an electronic scoring system is utilized. Forthe electronic scoring system to work each fencer wears a metallic vestor (lame) that covers the target area and a mask made of a metal wiremesh. The foil has a tip with an integrated electronic button at theend. A set of wires runs down the center of the blade and terminates atthe connectors on the underside of the bell guard. A wire electronicallyconnects the foil and the lamè to a reel that retracts and expands witheach fencer as they move. The reel is connected electronically to ascoring machine with a set of lights for scoring.

In one embodiment of the present invention, the tip 142 for the electricfencing foil 140 is formed with electrical contact points molded of theconductively doped resin-based material of the present invention.Typical tips used in electric foils are manufactured with electricalcontact points made of metal. However, in one embodiment of the presentinvention, the tip 142 is formed of the conductively doped resin-basedmaterial. The tip 142 may then be metal plated and/or metal coated.

In one embodiment, the blade 144 may be formed of the conductively dopedresin-based material of the present invention. Typical electric fencingfoil construction utilizes a blade that is forged from special alloysteel that incorporates iron, nickel, and titanium. However, in theembodiment of the present invention, the blade 144 formed of theconductively doped resin-based material may be formed to the desiredshape with a percent conductive loading, by weight, such that the amountof flex is similar to the flex of a metal forged blade. In oneembodiment, the blade 144 may be molded of the conductively dopedresin-based material of the present invention. The molded blade 144 maythen be metal plated and/or metal coated. In another embodiment, theblade 144 may be molded of the conductively doped resin-based materialwith a coloring or dye in the resin matrix to give the desiredappearance after the manufacturing process.

In one embodiment, the electrical connector 146 may be molded from theconductively doped resin-based material of the present invention.Typical electrical contact points for connectors are formed of metal.However, in one embodiment of the present invention, the connector 146may be molded from the conductively doped resin-based material. Themolded connector 146 may then be metal plated and/or metal coated. Inanother embodiment, the connector 146 may be molded of the conductivelydoped resin-based material and not metal plated and/or metal coated. Thebell guard 148 and the handle 147 may be formed of a non-conductiveresin-based material.

FIG. 13 illustrates one example of a sporting equipment device depictingone embodiment of the invention. A football helmet 140 is shown. Thefootball helmet 150 includes a structure 152 adapted to covering atleast a part of a human body wherein the structure 152 comprisesconductively doped resin-based material comprising micron conductivefiber in a base resin host. The football helmet 150 may include thestructure 152, or body, and a face mask 154. In various embodiments, thehelmet body 152 or the face guard 154 or both may be formed of theconductively doped resin-based material of the present invention.

In one embodiment, the helmet body 152 may be molded from theconductively doped resin-based material of the present invention. Thehelmet body 152 may be formed to the desired shape with a percentconductive loading, by weight, to allow high strength rigid protectionto the players head. In another embodiment, the conductively dopedresin-based helmet body 152 further includes an antenna 156 for anintegrated wireless transmitter/receiver unit, not shown. A wide varietyof antenna structures are easily formed of the conductively dopedresin-based material of the present invention. Monopole, dipole,geometric shapes, 2D, 3D, 4D, 5D, isotropic structures, planar, invertedF, PIFA, and the like, are all within the scope of the presentinvention. The antenna 156 design can be molded by, for example,injection molding. The molded antenna shape determines the resonantfrequency response of the antenna.

FIG. 14 illustrates one example of a sporting equipment device depictingone embodiment of the invention. A baseball batting helmet 160 is shown.The baseball helmet 150 includes a structure 160 adapted to covering atleast a part of a human body wherein the structure 160 comprisesconductively doped resin-based material comprising micron conductivefiber in a base resin host. The helmet 160 formed of the conductivelydoped resin-based material is preferably formed to the desired shapewith a percent conductive loading, by weight, to allow high strengthrigid protection to the players head.

FIG. 15 illustrates one example of a sporting equipment device depictingone embodiment of the invention. Shoulder pads 170 are shown. Theshoulder pads 170 include a structure 160 adapted to covering at least apart of a human body wherein the structure 160 comprises conductivelydoped resin-based material comprising micron conductive fiber in a baseresin host. The shoulder pads 170 are of a type useful for playingAmerican football or hockey. In the embodiment, any component or severalcomponents of the shoulder pads 170 comprise the conductively dopedresin-based material of the present invention. The shoulder pads 170 mayfurther include a chest pad 172, a cloth pad 178, a lower pad 176,and/or a top pad 174. In various embodiments, the chest pad 172, clothpad 178, lower pad 176, and/or the top pad 174 for the shoulder pads 170may be formed of the conductively doped resin-based material.

FIG. 16 illustrates one example of a sporting equipment device depictingone embodiment of the invention. An electronic fencing mask 180 isshown. The fencing mask 180 includes a structure 160 adapted to coveringat least a part of a human body wherein the structure 160, or shroud,comprises conductively doped resin-based material comprising micronconductive fiber in a base resin host. The electronic fencing mask 180may further include a mesh 182.

Typical electronic fencing mask construction utilizes stainless steelmesh capable of withstanding a 12 Kg punch test. The conductivity of themesh is necessary as is the conductivity of the shroud that covers thefront of the neck for electronic sabre fencing. When fencing withelectronic foils, the shroud for the neck does not require it to beconductive since the only score-able hit is to the body area that iscovered by the conductive lamè.

In one embodiment of the present invention, the mesh 182 is molded ofthe conductively doped resin-based material of the present invention.The mesh 182 for the electronic fencing mask 230 formed of theconductively doped resin-based material is preferably formed to thedesired shape with a percent conductive loading, by weight, such thatthe mesh 182 is rigid enough to withstand the 12 Kg punch test. Inanother embodiment, the mesh 182 is formed of the conductively dopedresin-based material and then metal plated and/or metal coated. Inanother embodiment, the mesh 182 is formed of the conductively dopedresin-based material with a coloring or dye in the resin matrix to allowfor the desired appearance after the manufacturing process.

In one embodiment, the fencing mask 180 further includes an electricalconnector 183 that may be formed of the conductively doped resin-basedmaterial and then may be metal plated and/or metal coated. In anotherembodiment, the electrical connector 183 is formed of the conductivelydoped resin-based material and not metal plated and/or metal coated.

FIG. 17 illustrates one example of a sporting equipment device depictingone embodiment of the invention. An electronic fencing lamè 190 isshown. The electronic fencing lamè 190 includes a structure 190 adaptedto covering at least a part of a human body wherein the structure 190comprises conductively doped resin-based material comprising micronconductive fiber in a base resin host.

Typical electronic fencing lamè construction utilizes an outerconductive fabric layer that is woven from stainless steel fibers. Thefencing lamè of this requires regular hand washing in order to clean thefabric of salt crystals left behind from dried sweat that can cause thebreak down of the metal fibers. However, in one embodiment of thepresent invention, the outer layer for the electronic fencing lamè 190is formed from a fabric comprising the conductively doped resin-basedmaterial. In this embodiment the conductively doped resin-based materialis extruded into a fine thread and then woven into a cloth like fabric.In one embodiment, the outer layer for the lamè 190 is formed of theconductively doped resin-based material and then may be metal platedand/or metal coated. In another embodiment, the outer layer for the lamè190 is formed of the conductively doped resin-based material with acoloring or dye in the resin to allow for the desired appearance afterthe manufacturing process.

In one embodiment, the lamè further includes an electrical connector 192that may be formed of the conductively doped resin-based material andthen may be metal plated and/or metal coated. In another embodiment, theelectrical connector 192 is formed of the conductively doped resin-basedmaterial and not metal plated and/or metal coated.

FIG. 18 illustrates one example of a sporting equipment device depictingone embodiment of the invention. A snowboard 200 is shown. The snowboard200 includes a sheet 202 of conductively doped resin-based materialcomprising micron conductive fiber in a base resin host and having a topsurface 205 and a bottom surface 207. The top surface 205 is adapted tosupport an operator. The bottom surface 207 is adapted for sliding. Thetop surface 205 may include bindings 204 adapted to couple to operatorboots, not shown. In various embodiments, the sheet 202, or boardplatform, or the bindings 204, or both, for the snowboard 200 are formedof the conductively doped resin-based material. The snowboard 200 formedof the conductively doped resin-based material is preferably formed tothe desired shape with a percent conductive loading, by weight, to allowthe flexibility desired to maneuver down the hill. The choice of thebase resin is selected from any number of resins capable of providingthe tensile strength needed for the snowboard 200.

In one embodiment of the present invention, the board platform 202 ismolded with an outer layer of a non-conductive resin-based material byfor example co-extrusion. The outer layer resin-based material is chosenfrom any number of resins that will provide the bottom 207 of thesnowboard 200 with an extremely non-porous slippery surface. In anotherembodiment, the board platform 202 is formed entirely of theconductively doped resin-based material without an additional outerlayer.

FIG. 19 illustrates one example of a sporting equipment device depictingone embodiment of the invention. A skateboard 210 is shown. Theskateboard 210 includes a sheet 212, or board platform, of conductivelydoped resin-based material comprising micron conductive fiber in a baseresin host and having a top surface 215 and a bottom surface 217. Thetop surface 215 is adapted to support an operator. The bottom surface217 includes wheels 218. In various embodiments, the board platform 212or the wheels 218, or both, for the skateboard 210 are formed of theconductively doped resin-based material. The skateboard 210 formed ofthe conductively doped resin-based material is preferably formed to thedesired shape with a percent conductive loading, by weight, to allow theflexibility desired to maneuver. The choice of the base resin isselected from any number of resins capable of providing the tensilestrength needed for the skateboard 210.

FIG. 20 illustrates one example of sporting equipment devices depictingone embodiment of the invention. Snow skis 220 and ski poles 230 areshown. The snow skis 220 includes a sheet 222 of conductively dopedresin-based material comprising micron conductive fiber in a base resinhost and having a top surface 225 and a bottom surface 227. The topsurface 22 is adapted to support an operator. The bottom surface 2207 isadapted for sliding. The top surface 225 may include bindings 224adapted to couple to operator boots, not shown. In various embodiments,the sheet 222, or board platform, or the bindings 224, or both, for thesnow skis 220 are formed of the conductively doped resin-based material.The snowboard 220 formed of the conductively doped resin-based materialis preferably formed to the desired shape with a percent conductiveloading, by weight, to allow the flexibility desired to maneuver downthe hill. The choice of the base resin is selected from any number ofresins capable of providing the tensile strength needed for the snowskis 220.

In one embodiment of the present invention, the board platform 222 ismolded with an outer layer of a non-conductive resin-based material byfor example co-extrusion. The outer layer resin-based material is chosenfrom any number of resins that will provide the bottom 207 of the snowskis 220 with an extremely non-porous slippery surface. In anotherembodiment, the board platform 222 is formed entirely of theconductively doped resin-based material without an additional outerlayer.

The ski poles 230 includes an operator handle 233 attached to a strikingsurface 235. Typical ski pole construction utilizes light weight carbonfiber or aluminum shafts. However, in one embodiment of the presentinvention, the ski poles 230 are molded from the conductively dopedresin-based material of the present invention and then may be metalcoated and/or metal plated. In another embodiment, the ski poles 230 aremolded from the conductively doped resin-based material and are notmetal plated and/or metal coated. The ski poles 230 formed of theconductively doped resin-based material are preferably formed to thedesired shape with a percent conductive loading, by weight, to give itthe desired rigidity needed by the skier.

FIG. 21 illustrates one example of a sporting equipment device depictingone embodiment of the invention. A hockey puck 250 is shown. The hockeypuck 250 includes a body 252 formed of the conductively dopedresin-based material. In addition, the hockey puck may include anantenna 254 formed of the conductively doped resin-based material andcoupled to a wireless transmitter/receiver, not shown, to be placed inthe core of the puck 250. A wide variety of antenna structures areeasily formed of the conductively doped resin-based material of thepresent invention. Monopole, dipole, geometric shapes, 2D, 3D, 4D, 5D,isotropic structures, planar, inverted F, PIFA, and the like, are allwithin the scope of the present invention. The antenna 254 design can bemolded by, for example, injection molding. The molded antenna 254 shapedetermines the resonant frequency response of the antenna. The internaltransmitting/receiving device in the puck 250 sends a signal to apositioning receiving sensor inside a television camera and focuses thecamera on the puck 250 during play.

FIGS. 22-24 illustrate one example of a part of a sporting equipmentdevice and method of manufacture depicting one embodiment of theinvention. An operator handle for a sporting equipment device, and amethod of manufacture, are illustrated. In particular, in FIG. 22 showsan operator handle 300 at a preliminary step in manufacture. A bundled310 of continuous strands of micron conductive fiber is shown. Themicron conductive fiber is further illustrated in FIG. 23 which shown across section of the bundle 310 of FIG. 22 taken along lines 23-23. Thebundle 310 may have a relatively circular cross-sectional shape 320, forexample. Alternatively, the bundle 310 cross-sectional shape 320 may beany shape, may have a hollow interior to the shape, or may be amorphous.Alternatively, the continuous strands of micron conductive fiber 310 maybe woven or webbed together. The micron conductive fiber 310 may bemetal, such as stainless steel micron fiber, copper micron fiber, silvermicron fiber or combinations thereof. The micron conductive fiber 310may be a non-metal fiber that is metal plated, such as metal platedcarbon fiber. Referring now to FIG. 24, the continuous strands of micronconductive fiber is molded with a resin-based material 330 to completethe operator handle 300. Preferably, the resin-based material is moldedunder pressure 340 to force the resin-based material to thoroughly wetthe strands of micron conductive fiber 310. Molding may be, for example,by injection molding resin-based material 330 on the bundle 310 ofcontinuous micron conductive fiber 310 inserted into a mold.Alternatively, the resin-based material 330 may be extruded onto thecontinuous strands of micron conductive fiber 310. The resultingoperator handle 300 may be used in any sporting equipment applicationincluding, but not limited to, golf clubs, racquets, hockey sticks, skipoles, and fishing poles.

FIG. 25 illustrates one example one example of a part of a sportingequipment device depicting one embodiment of the invention. Anotheroperator handle 350 for a sporting equipment device is shown. Theoperator handle 350 may included, for example, a core portion 352, abundle 354 of continuous strands of micron conductive fiber surroundingthe core portion 352, and a resin-based material 356 molded onto thebundle 354. The core portion 352 may have a relatively circularcross-sectional shape, for example. Alternatively, the core portion 352cross-sectional shape may be any shape. The core portion 352 may be aresin-based material. The bundle 354 of continuous strands of micronconductive fiber may be woven or webbed together. The micron conductivefiber may be metal, such as stainless steel micron fiber, copper micronfiber, silver micron fiber or combinations thereof. The micronconductive fiber may be a non-metal fiber that is metal plated, such asmetal plated carbon fiber. The bundle 354 of continuous strands ofmicron conductive fiber may be wrapped onto the core 352 and further betwisted or radially turned about the core 352. The resin-based material356 may be molded under pressure to force the resin-based material 356to thoroughly wet the strands of the bundle 354 of continuous micronconductive fiber. Molding may be, for example, by injection moldingresin-based material 356 on a sub-assembly of the core portion 352 andbundle 354 inserted into a mold. Alternatively, the resin-based material356 may be extruded onto the sub-assembly of the core portion 352 andbundle 354. The resulting operator handle 350 may be used in anysporting equipment application including, but not limited to, golfclubs, racquets, hockey sticks, ski poles, and fishing poles.

FIG. 26 illustrates one example one example of a part of a sportingequipment device depicting one embodiment of the invention. Anotheroperator handle 360 for a sporting equipment device is shown. Theoperator handle 360 may included, for example, a core portion includinga first bundle 366 of continuous strands of micron conductive fibermolded with a resin-based material 362. The core portion 362 and 366 mayhave a relatively circular cross-sectional shape, for example.Alternatively, the core portion 362 and 366 cross-sectional shape may beany shape. The bundle 366 of continuous strands of micron conductivefiber may be woven or webbed together. The micron conductive fiber maybe metal, such as stainless steel micron fiber, copper micron fiber,silver micron fiber or combinations thereof. The micron conductive fibermay be a non-metal fiber that is metal plated, such as metal platedcarbon fiber. A second bundle 364 of continuous strands of micronconductive fiber may be wrapped onto the core portion 362 and 366 andfurther be twisted or radially turned about the core portion 362 and366. The second bundle 364 of continuous strands of micron conductivefiber may be woven or webbed together. The micron conductive fiber maybe metal, such as stainless steel micron fiber, copper micron fiber,silver micron fiber or combinations thereof The micron conductive fibermay be a non-metal fiber that is metal plated, such as metal platedcarbon fiber. A second resin-based material 368 may be molded underpressure to force the resin-based material 368 to thoroughly wet thestrands of the second bundle 364 of continuous micron conductive fiber.Molding may be, for example, by injection molding resin-based material368 onto the second bundle 364 inserted into a mold. Alternatively, theresin-based material 368 may be extruded onto the second bundle 364. Theresulting operator handle 360 may be used in any sporting equipmentapplication including, but not limited to, golf clubs, racquets, hockeysticks, ski poles, and fishing poles.

The conductively doped resin-based material typically comprises a micronpowder(s) of conductor particles and/or in combination of micronfiber(s) substantially homogenized within a base resin host. FIG. 2shows a cross section view of an example of conductively dopedresin-based material 32 having powder of conductor particles 34 in abase resin host 30. In this example the diameter D of the conductorparticles 34 in the powder is between about 3 and 12 microns.

FIG. 3 shows a cross section view of an example of conductively dopedresin-based material 36 having conductor fibers 38 in a base resin host30. The conductor fibers 38 have a diameter of between about 3 and 12microns, typically in the range of 10 microns or between about 8 and 12microns, and a length of between about 2 and 14 millimeters. The micronconductive fibers 38 may be metal fiber or metal plated fiber. Further,the metal plated fiber may be formed by plating metal onto a metal fiberor by plating metal onto a non-metal fiber. Exemplary metal fibersinclude, but are not limited to, stainless steel fiber, copper fiber,nickel fiber, silver fiber, aluminum fiber, nichrome fiber, or the like,or combinations thereof. Exemplary metal plating materials include, butare not limited to, copper, nickel, cobalt, silver, gold, palladium,platinum, ruthenium, rhodium, and nichrome, and alloys of thereof. Anyplatable fiber may be used as the core for a non-metal fiber. Exemplarynon-metal fibers include, but are not limited to, carbon, graphite,polyester, basalt, man-made and naturally-occurring materials, and thelike. In addition, superconductor metals, such as titanium, nickel,niobium, and zirconium, and alloys of titanium, nickel, niobium, andzirconium may also be used as micron conductive fibers and/or as metalplating onto fibers in the present invention.

These conductor particles and/or fibers are substantially homogenizedwithin a base resin. As previously mentioned, the conductively dopedresin-based materials have a sheet resistance of less than about 5 tomore than about 25 ohms per square, though other values can be achievedby varying the doping parameters and/or resin selection. To realize thissheet resistance the weight of the conductor material comprises betweenabout 20% and about 50% of the total weight of the conductively dopedresin-based material. More preferably, the weight of the conductivematerial comprises between about 20% and about 40% of the total weightof the conductively doped resin-based material. More preferably yet, theweight of the conductive material comprises between about 25% and about35% of the total weight of the conductively doped resin-based material.Still more preferably yet, the weight of the conductive materialcomprises about 30% of the total weight of the conductively dopedresin-based material. Stainless Steel Fiber of 6-12 micron in diameterand lengths of 4-6 mm and comprising, by weight, about 30% of the totalweight of the conductively doped resin-based material will produce avery highly conductive parameter, efficient within any EMF, thermal,acoustic, or electronic spectrum.

In yet another preferred embodiment of the present invention, theconductive doping is determined using a volume percentage. In a mostpreferred embodiment, the conductive doping comprises a volume ofbetween about 4% and about 10% of the total volume of the conductivelydoped resin-based material. In a less preferred embodiment, theconductive doping comprises a volume of between about 1% and about 50%of the total volume of the conductively doped resin-based materialthough the properties of the base resin may be impacted by high percentvolume doping.

Referring now to FIG. 4, another preferred embodiment of the presentinvention is illustrated where the conductive materials comprise acombination of both conductive powders 34 and micron conductive fibers38 substantially homogenized together within the resin base 30 during amolding process.

Referring now to FIGS. 5 a and 5 b , a preferred composition of theconductively doped, resin-based material is illustrated. Theconductively doped resin-based material can be formed into fibers ortextiles that are then woven or webbed into a conductive fabric. Theconductively doped resin-based material is formed in strands that can bewoven as shown. FIG. 5 a shows a conductive fabric 42 where the fibersare woven together in a two-dimensional weave 46 and 50 of fibers ortextiles. FIG. 5 b shows a conductive fabric 42′ where the fibers areformed in a webbed arrangement. In the webbed arrangement, one or morecontinuous strands of the conductive fiber are nested in a randomfashion. The resulting conductive fabrics or textiles 42, see FIG. 5 a,and 42′, see FIG. 5 b, can be made very thin, thick, rigid, flexible orin solid form(s).

Similarly, a conductive, but cloth-like, material can be formed usingwoven or webbed micron stainless steel fibers, or other micronconductive fibers. These woven or webbed conductive cloths could also besandwich laminated to one or more layers of materials such asPolyester(s), Teflon(s), Kevlar(s) or any other desired resin-basedmaterial(s). This conductive fabric may then be cut into desired shapesand sizes.

Articles formed from conductively doped resin-based materials can beformed or molded in a number of different ways including injectionmolding, extrusion, calendaring, compression molding, thermoset molding,or chemically induced molding or forming. FIG. 6 a shows a simplifiedschematic diagram of an injection mold showing a lower portion 54 andupper portion 58 of the mold 50. Conductively doped resin-based materialis injected into the mold cavity 64 through an injection opening 60 andthen the substantially homogenized conductive material cures by thermalreaction. The upper portion 58 and lower portion 54 of the mold are thenseparated or parted and the articles are removed.

FIG. 6 b shows a simplified schematic diagram of an extruder 70 forforming articles using extrusion. Conductively doped resin-basedmaterial(s) is placed in the hopper 80 of the extrusion unit 74. Apiston, screw, press or other means 78 is then used to force thermallymolten, chemically-induced compression, or thermoset curing conductivelydoped resin-based material through an extrusion opening 82 which shapesthe thermally molten curing or chemically induced cured conductivelydoped resin-based material to the desired shape. The conductively dopedresin-based material is then fully cured by chemical reaction or thermalreaction to a hardened or pliable state and is ready for use.Thermoplastic or thermosetting resin-based materials and associatedprocesses may be used in molding the conductively doped resin-basedarticles of the present invention.

Accordingly, many advantages of the above illustrated describedstructure will be recognized by those ordinary skilled in the art. Assuch, a sporting equipment device is disclosed with excellentperformance including tunable frequency, trampoline response, low costof manufacture, durability, and low weight. In addition, antenna devicesor conductive sensing may be integrated into the device due to theconductivity of the conductively doped resin-based material.

The above detailed description of the invention, and the examplesdescribed therein, has been presented for the purposes of illustrationand description. While the principles of the invention have beendescribed above in connection with a specific device, it is to beclearly understood that this description is made only by way of exampleand not as a limitation on the scope of the invention.

1. A sporting equipment device comprising: an operator handle; and astriking surface operatively coupled to the operator handle wherein thestriking surface comprises a conductively doped, resin-based materialcomprising micron conductive fiber in a base resin host.
 2. The deviceaccording to claim 1 wherein the percent by weight of the micronconductive fiber is between about 20% and about 50% of the total weightof the conductively doped resin-based material.
 3. The device accordingto claim 1 wherein the conductively doped, resin-based material furthercomprises conductive powder.
 4. The device according to claim 1 whereinthe micron conductive fiber is metal.
 5. The device according to claim 1wherein the micron conductive fiber is a non-metal material with metalplating.
 6. The device according to claim 1 wherein the micronconductive fiber is metal plated carbon micron fiber, stainless steelmicron fiber, copper micron fiber, silver micron fiber or combinationsthereof.
 7. The device according to claim 1 further comprising a metallayer overlying the conductively doped resin-based material.
 8. Thedevice according to claim 1 wherein the operator handle comprises theconductively doped resin-based material.
 9. A sporting equipment devicecomprising: an operator handle wherein the operator handle comprises aconductively doped, resin-based material comprising micron conductivefiber in a base resin host; and a striking surface operatively coupledto the operator handle.
 10. The device according to claim 9 wherein thepercent by weight of the micron conductive fiber is between about 20%and about 50% of the total weight of the conductively doped resin-basedmaterial.
 11. The device according to claim 9 wherein the conductivelydoped, resin-based material further comprises conductive powder.
 12. Thedevice according to claim 9 wherein the micron conductive fiber ismetal.
 13. The device according to claim 9 wherein the micron conductivefiber is a non-metal material with metal plating.
 14. The deviceaccording to claim 9 further comprising a metal layer overlying theconductively doped resin-based material.
 15. The device according toclaim 9 wherein the conductive materials are metal plated carbon micronfiber, stainless steel micron fiber, copper micron fiber, silver micronfiber or combinations thereof.
 16. A sporting equipment devicecomprising a structure adapted to covering at least a part of a humanbody wherein the structure comprises conductively doped resin-basedmaterial comprising micron conductive fiber in a base resin host. 17.The device according to claim 16 wherein the percent by weight of themicron conductive fiber is between about 20% and about 50% of the totalweight of the conductively doped resin-based material.
 18. The deviceaccording to claim 16 wherein the conductively doped, resin-basedmaterial further comprises conductive powder.
 19. The device accordingto claim 16 wherein the micron conductive fiber is metal.
 20. The deviceaccording to claim 16 wherein the micron conductive fiber is a non-metalmaterial with metal plating.
 21. The device according to claim 16further comprising a metal layer overlying the conductively dopedresin-based material.
 22. The device according to claim 16 wherein theconductive materials are metal plated carbon micron fiber, stainlesssteel micron fiber, copper micron fiber, silver micron fiber orcombinations thereof.
 23. The device according to claim 16 wherein thepart of the human body is the human head.
 24. The device according toclaim 16 further comprising an antenna comprising the conductively dopedresin-based material and operatively coupled to the structure.
 25. Asporting equipment device comprising a sheet of conductively dopedresin-based material comprising micron conductive fiber in a base resinhost and having a top surface and a bottom surface wherein the topsurface is adapted to support an operator and wherein the bottom surfaceis adapted for sliding.
 26. The device according to claim 25 wherein thepercent by weight of the micron conductive fiber is between about 20%and about 50% of the total weight of the conductively doped resin-basedmaterial.
 27. The device according to claim 25 wherein the micronconductive fiber is metal.
 28. The device according to claim 25 whereinthe micron conductive fiber is a non-metal material with metal plating.29. The device according to claim 25 further comprising a metal layeroverlying the conductively doped resin-based material.
 30. The deviceaccording to claim 25 wherein the conductive materials are metal platedcarbon micron fiber, stainless steel micron fiber, copper micron fiber,silver micron fiber or combinations thereof.
 31. The device according toclaim 25 further comprising at least one wheel operatively coupled tothe sheet.
 32. A sporting equipment device comprising: an operatorhandle wherein the operator handle comprises a plurality of continuousstrands of micron conductive fiber molded into a resin-based material;and a striking surface operatively coupled to the operator handle. 33.The device according to claim 34 wherein the micron conductive fiber ismetal.
 34. The device according to claim 34 wherein the micronconductive fiber is a non-metal material with metal plating.
 35. Thedevice according to claim 34 wherein the plurality of continuous strandsof micron conductive fiber are webbed or woven together.
 36. The deviceaccording to claim 34 wherein the plurality of continuous strands ofmicron conductive fiber are oriented in the longitudinal direction ofthe operator handle.
 37. The device according to claim 34 wherein theoperator handle further comprises a core portion wherein the pluralityof continuous strands of micron conductive fiber surround the coreportion.
 38. The device according to claim 34 wherein the operatorhandle further comprises a second plurality of continuous strands ofmicron conductive fiber surrounding the plurality of continuous strandsof micron conductive fiber molded into a resin-based material.